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HMDS (Hexamethyldisilazane) process recipe

HMDS (hexamethyldisilazane) is a vapor-phase adhesion promoter used ahead of photoresist coating: it chemically converts a hydrophilic, oxidized substrate surface (native/thermal SiO2, quartz, glass, most base metals) into a hydrophobic, resist-wetting surface by bonding a monolayer of trimethylsilyl groups, releasing ammonia as a byproduct.

https://nanyte.com/photoresists/hmds · last updated 2026-07-26

At a glance
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Manufacturer
MicroChemicals GmbH (application-note publisher; HMDS itself is a commodity chemical sold by many suppliers, not a single manufacturer's proprietary product)
Tone
Not photoimageable (underlayer)
Chemistry
Ancillary (not photoimageable)
Exposure dose
Not exposed — dissolves in developer
  1. Substrate
  2. Prime
    75–120 °C
  3. Coat resist
  • Substrate
  • Primer
  • Resist
The prime bonds a monolayer to the bare substrate and the imaging resist is coated over it — nothing in this step is exposed or developed. Schematic cross-sections for HMDS (Hexamethyldisilazane) — feature width, film aspect ratio and sidewall angle are illustrative, not to scale.
01 / Coating

Spin coating

The manufacturer does not publish a spin curve for HMDS (Hexamethyldisilazane).

  • HMDS must not be spin-coated as a liquid — the only correct application is vapor-phase, via a nitrogen-carrier 'bubbler' held at room temperature feeding a heated (75-120°C) substrate, where HMDS bonds chemically as a monolayer ("Correct Use of HMDS", Fig. 47-48, p.2).
  • If liquid HMDS is spun on instead, the resulting layer is only physically (not chemically) bound; ammonia released from it during the resist softbake diffuses into and cross-links the resist near the substrate, suppressing development and degrading resolution and profile ("Incorrect Application of HMDS", Fig. 49, p.2-3) — this failure mode is explicitly documented, not inferred.
  • For the same reason, the note advises against applying HMDS in the same spin coater used for resist coating (slow HMDS evaporation can contaminate later coating runs); if spin-application is unavoidable, it recommends a 100-120°C water-desorption bake beforehand, a 100-120°C thermal-activation bake afterward, and strict spatial separation from resist-coating equipment (p.3).
  • There is no legitimate spin-speed-vs-thickness relationship for a vapor-deposited chemisorbed monolayer, so HMDS has no spin curve at all — that is the chemistry, not missing data.
Adhesion
HMDS not required — Not applicable — this entry describes HMDS itself (the adhesion promoter), not a photoresist that would require HMDS pretreatment.
02 / Bake

Prime

Prime
75–120 °C
Notes
Vapor-phase application: HMDS vapor is carried by dry nitrogen from a room-temperature bubbler onto a substrate held at 75-120°C, where it bonds chemically as a monolayer. That 75-120°C is the substrate temperature during the prime itself, not a bake of a coated film — HMDS goes on bare substrate, before any resist. No dwell time is published. If HMDS can only be spin-coated — documented, but explicitly the wrong way to apply it — bake at 100-120°C beforehand to desorb water, then again at 100-120°C to activate after application. Independently of which adhesion promoter is used, a substrate dehydration bake of roughly 120°C for a few minutes (above 140°C on oxidized surfaces, for maximum adhesion) precedes the prime.

SOURCE: Correct Use of HMDS / Incorrect Application of HMDS, p.2-3; Adsorbed Water, p.1

03 / Exposure

Exposure

HMDS (Hexamethyldisilazane) is not photoimageable. It is not exposed at all — it is coated beneath an imaged top resist and undercut laterally during development. See the development step below.

04 / Development

Development

Not published for this resist: Developer, Dilution, Time, Method, Rinse — characterize on-tool.

05 / Post-processing

Hard bake, etch & strip

Not published for this resist: Hard bake, Descum, Etch resistance, Stripper, Storage — characterize on-tool.

06 / Applications

Where it's used

Practical notes from the datasheet

HMDS (hexamethyldisilazane) is a vapor-phase adhesion promoter, not a photoimageable resist: it converts a hydrophilic, OH-terminated oxide surface (native or thermal SiO2, quartz, glass, most base metals) into a hydrophobic, resist-wetting surface by chemically bonding a monolayer of non-polar trimethylsilyl groups, releasing ammonia as a byproduct (p.2). The only correct application is vapor-phase, via a nitrogen-carrier bubbler at room temperature feeding a substrate heated to 75-120°C; spin-coating liquid HMDS instead yields only a physically bound layer whose ammonia, released during the subsequent resist softbake, diffuses into and cross-links the resist near the substrate, suppressing development and degrading resolution — a failure mode this note documents explicitly as 'Incorrect Application' (p.2-3). On noble metals without native oxide (gold, platinum), HMDS and other organic adhesion promoters show little to no adhesion benefit because they cannot chemically bond to the surface; base metals such as Al, Cr and especially Ti already adhere well without a promoter (p.3-4). This document is a general MicroChemicals application-note chapter ('01 Chapter — Basics of Microstructuring: Substrate Preparation'), not a manufacturer technical datasheet for a specific HMDS product or grade — HMDS itself is a commodity chemical sold by many suppliers, and this note is the correct place to attribute process guidance about it rather than any single vendor's TDS.

07 / Sources

Sources & disclaimer

Research using this resist
  1. Kawai and Kawakami. Characterization of SiO2 Surface Treated by HMDS Vapor and O2 Plasma with AFM Tip. Journal of Photopolymer Science and Technology (2003). doi:10.2494/photopolymer.16.665
    Silicon oxide substrates are silane-coupling treated with HMDS and separately exposed to oxygen plasma, then probed with an AFM tip to characterize the resulting surface. Measures the surface change that HMDS priming is performed to produce, on the oxide that resist is subsequently coated onto.

Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-07-26.

Cite this recipe

NANYTE. "HMDS (Hexamethyldisilazane) process recipe." NANYTE Photoresist Library. https://nanyte.com/photoresists/hmds. Accessed 2026-07-26.

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