https://nanyte.com/photoresists/durimide-7500 · last updated 2026-10-15
- Manufacturer
- Fujifilm
- Grades
- Durimide 7505 · Durimide 7510 · Durimide 75201
- Tone
- negative
- Chemistry
- Polyimide
- Thickness
- 2–25 µm
- Developer
- HTR-D2 developer with RER 600 rinse
Cross-checked — the spin curve (where published) and the single-value figures were read twice, independently, from the datasheet, with any disagreement settled against it.
- Substrate
- Resist
- Exposed
Spin coating
Data points
| Series | rpm | µm |
|---|---|---|
| Durimide 7505 (soft-bake thickness) | 1000 | 17 |
| 2000 | 8.6 | |
| 3000 | 6.5 | |
| 4000 | 5.0 | |
| Durimide 7510 (soft-bake thickness) | 1000 | 34 |
| 2000 | 17 | |
| 3000 | 12 | |
| 4000 | 8.0 | |
| Durimide 7520 (soft-bake thickness) | 1000 | 48 |
| 2000 | 25 | |
| 3000 | 18 | |
| 4000 | 12 |
Values are the manufacturer’s starting points, not a guarantee — characterize on your own tool. Series digitized from a published figure are approximate (±10 %).
Durimide 7505 (soft-bake thickness): read from figure, 'Spin curve (spin time = 30 seconds)', p.2 of Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5); linear axes, soft-bake film thickness against spin speed, plotted dots at 1000, 2000, 3000 and 4000 rpm, read against the chart's gridlines to about ±0.3 µm. 7505 is the light-green dots (lowest curve). The p.2 charts use 5 µm soft-bake thickness as the 7505 reference film.
Durimide 7510 (soft-bake thickness): read from figure, 'Spin curve (spin time = 30 seconds)', p.2 of Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5); linear axes, soft-bake film thickness against spin speed, plotted dots at 1000, 2000, 3000 and 4000 rpm, read against the chart's gridlines to about ±0.3 µm. 7510 is the mid-green dots with a lighter ring (middle curve). The p.2 charts use 15 µm soft-bake thickness as the 7510 reference film.
Durimide 7520 (soft-bake thickness): read from figure, 'Spin curve (spin time = 30 seconds)', p.2 of Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5); linear axes, soft-bake film thickness against spin speed, plotted dots at 1000, 2000, 3000 and 4000 rpm, read against the chart's gridlines to about ±0.3 µm. 7520 is the dark-teal dots (top curve). The p.2 charts use 20 µm soft-bake thickness as the 7520 reference film.
- The curves are soft-bake film thickness for a 30 s spin, so the cured film ends up roughly 45 % thinner.
- The sheet recommends a spin time of 30–60 s and says thickness can also be tuned through spin time, not just speed.
- HTR-D2 is listed for back-side rinse and edge-bead removal.
- The datasheet gives no dispense volume or ramp.
- Adhesion
- HMDS not required — The sheet calls the film self-priming, with no external adhesion promoter required. Listed substrates are silicon, SiOxNy, SiC, epoxy, Al and Ag; the process-window box flags that it is not Cu-compatible (p.1, p.2).
Soft bake
- Soft bake
- 100–110 °C · 4–6 min
- Notes
- 100–110 °C for 4–6 minutes, with the exact schedule depending on film thickness. The datasheet does not say whether this is a hotplate or an oven bake, and gives no thickness-to-time table.
SOURCE: Durimide 7500-series process window, Soft Bake, p.2 of…
Durimide 7500-series process window, Soft Bake, p.2 of Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5)
Exposure dose
Fujifilm prints a single 60–200 mJ/cm² window for the whole series, covering mask aligners and steppers (broadband, i-, g- and h-line) and 405 nm direct write, focused about a third of the way into the film. Run a dose array on your own tool to land the working dose.
- Post-exposure delay
- 30 min @ RT (or a 50 °C / 60 s PEB instead)
- Post-exposure bake
- 50 °C · 60 s (optional — alternative to a 30 min room-temperature delay)
Not published for this resist: Dose at 365 nm, Dose at 405 nm — characterize on-tool.
SOURCE: Durimide 7500-series process window, p.2: 'Post Exposure Delay: 30 min @ RT or Post Exposure Bake: 60 sec @ 50°C'
Development
- Developer
- HTR-D2 developer with RER 600 rinse
- Dilution
- Not published — characterize on-tool
- Time
- 30 s
- Method
- atomized spray, continuous spray or multiple puddle
- Rinse
- RER 600, 15 s, following a 10 s overlap with the developer.
SOURCE: Durimide 7500-series process window, 'Dev. process' and…
Durimide 7500-series process window, 'Dev. process' and 'Developer/Overlap/Rinse: HTR-D2/RER 600 30"/10"/15"', p.2 of Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5)
Hard bake, etch & strip
- Hard bake
- 350–420 °C · 60 min
- Descum
- A short O2-plasma descum is listed in the process window; no power, pressure or time is given.
- Stripper
- MS 3001 (NMP free) or NMP, listed as stripper products (p.1).
Not published for this resist: Etch resistance, Storage — characterize on-tool.
SOURCE: Durimide 7500-series process window, 'Final cure conditions'…
Durimide 7500-series process window, 'Final cure conditions', p.2, and 'Typical cured film properties', p.1 of Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5)
Where it's used
Practical notes from the datasheet
Durimide 7500 is a polyimide that stays on the device: it is exposed as a negative-tone precursor, developed, then cured at 350–420 °C into a film with the 215 MPa tensile strength, 2.5 GPa modulus, 85 % elongation, 285 °C glass transition and 3.2–3.3 dielectric constant the sheet quotes for a 350 °C cure. The three grades split the thickness range by viscosity: 7505 (1200 cSt) cures to 2–5 µm, 7510 (3300 cSt) to 4–15 µm and 7520 (6100 cSt) to 11–25+ µm. Exposure is one 60–200 mJ/cm² window for mask aligner, stepper and 405 nm direct-write tools, focused about a third of the way into the film. Read from the plots, thickness retention after develop is highest at higher dose (roughly 80 % for 7505 and 90 % for 7510 and 7520 near 100 mJ/cm²), and the minimum resolvable feature is smallest between about 75 and 110 mJ/cm² before it degrades above roughly 150 mJ/cm². Shown results are a 10 µm via in a 10 µm soft-bake film on an i-line stepper and 12 µm lines and spaces in a 44 µm soft-bake film on a g-line stepper. Not compatible with copper.
Troubleshooting
Common failure modes for Durimide 7500, answered from the manufacturer's datasheet and application notes. These are starting points — your substrate, tooling and environment shift the specifics, so calibrate on-tool.
Can Durimide 7500 go on copper?
No. The process window lists silicon, SiOxNy, SiC, epoxy, Al and Ag as substrates and flags the list as not Cu-compatible. The resist is self-priming, so no adhesion promoter is called for on the listed substrates.
SOURCE: Fujifilm Durimide 7500-series Technical Product Information…
Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5) — process window, Substrate and footnote, p.2; p.1 characteristics
How thick will the film be after cure?
Expect about 45 % shrinkage from soft bake to cure, so a soft-baked film cures to roughly 55 % of its thickness. The spin curves are soft-bake thickness, while the grade ranges (2–5, 4–15 and 11–25+ µm) are cured thickness.
SOURCE: Fujifilm Durimide 7500-series Technical Product Information…
Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5) — p.2 spin-curve notes; grade table, p.1
Where should I set focus for Durimide 7500?
The process window says to focus into the film, at about one third of the film thickness. It lists focus separately from the 60–200 mJ/cm² exposure window, which applies to the mask aligner, stepper and 405 nm direct-write tools alike.
SOURCE: Fujifilm Durimide 7500-series Technical Product Information…
Fujifilm Durimide 7500-series Technical Product Information (EU-FCD-01147 Rev 5) — process window, Focus Range and Exp. Range, p.2
Sources & disclaimer
- Fujifilm — Durimide 7500 datasheet (EU-FCD-01147 Rev 5) · accessed 2026-10-15
- The p.1 grade table lists Durimide 7505 (1200 cSt, 2–5 µm cured), Durimide 7510 (3300 cSt, 4–15 µm cured) and Durimide 7520 (6100 cSt, 11–25+ µm cured); the p.2 spin-curve legend plots the same three grades.
Manufacturer datasheet values are starting points; optimal parameters depend on your substrate, equipment and environment. Product names and trademarks belong to their respective owners. NANYTE is not affiliated with the manufacturers listed. Last updated 2026-10-15.